The invention relates to a micro-scale cooling element (1) having a mounting surface (2) for a constituent part, in particular a semiconductor component, that is to be cooled, which element is configured, in particular, cuboidally and has in the interior a micro-scale cooling structure (3) that is connected via connecting conduits (4) to at least one inflow opening (5) and at least one outflow opening (6) through which a cooling medium is conveyable to and dischargeable from the micro-scale structure (3), the micro-scale cooling element having a monolithic structure.