Invention Grant
US09084377B2 Integrated circuit package system with mounting features for clearance
有权
集成电路封装系统，具有安装功能，用于间隙
- Patent Title: Integrated circuit package system with mounting features for clearance
- Patent Title (中): 集成电路封装系统，具有安装功能，用于间隙
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Application No.: US11694913Application Date: 2007-03-30
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Publication No.: US09084377B2Publication Date: 2015-07-14
- Inventor: Seng Guan Chow
- Applicant: Seng Guan Chow
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H05K3/28 ; H05K1/11 ; H05K3/12 ; H05K3/40
Abstract:
An integrated circuit package system is provided including providing a substrate having a contact pad, forming a first conductor having a first melting point over the contact pad, forming a second conductor having a second melting point over the first conductor with the first melting point higher than the second melting point, and mounting a first device over the second conductor.
Public/Granted literature
- US20080235941A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING FEATURES Public/Granted day:2008-10-02
Information query
