Invention Grant
US09085111B2 Optical element, optical element wafer, optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device
有权
光学元件，光学元件晶片，光学元件晶片模块，光学元件模块，光学元件模块的制造方法，电子元件晶片模块，电子元件模块的制造方法，电子元件模块和电子信息装置
- Patent Title: Optical element, optical element wafer, optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device
- Patent Title (中): 光学元件，光学元件晶片，光学元件晶片模块，光学元件模块，光学元件模块的制造方法，电子元件晶片模块，电子元件模块的制造方法，电子元件模块和电子信息装置
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Application No.: US12586482Application Date: 2009-09-23
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Publication No.: US09085111B2Publication Date: 2015-07-21
- Inventor: Yuji Yano , Takahiro Nakahashi , Tetsuya Tamiya
- Applicant: Yuji Yano , Takahiro Nakahashi , Tetsuya Tamiya
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Keating & Bennett, LLP
- Priority: JP2008-246969 20080925; JP2009-199023 20090828
- Main IPC: B29D11/00
- IPC: B29D11/00 ; G02B7/02 ; G02B13/00
Abstract:
An optical element according to the present invention includes: an optical surface at a center portion thereof; a spacer section having a predetermined thickness on an outer circumference side of the optical surface; a support plate including one or a plurality of through holes penetrating the optical surface, inside a transparent resin material; and a penetrating portion and/or a concave portion for releasing the resin material when forming resin, in a further outer peripheral portion of the support plate.
Public/Granted literature
Information query
