Invention Grant
- Patent Title: Bundle of long thin carbon structures, manufacturing method therefor, and electronic device
- Patent Title (中): 长薄碳结构的束，其制造方法和电子器件
-
Application No.: US13278347Application Date: 2011-10-21
-
Publication No.: US09085831B2Publication Date: 2015-07-21
- Inventor: Daiyu Kondo
- Applicant: Daiyu Kondo
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2006-325297 20061201
- Main IPC: B32B9/00
- IPC: B32B9/00 ; D01F9/127 ; C01B31/02 ; B82Y30/00 ; B82Y40/00 ; C23C16/02 ; C23C16/26 ; H01L21/768 ; H01L23/373 ; H01L23/532 ; B01J23/75 ; H01B1/04 ; B01J21/06 ; B01J23/74 ; B01J27/24 ; H01L23/00
Abstract:
In the bundle of long thin carbon structures of the present invention, end parts of the bundle are interconnected in a carbon network. The interconnected end parts form a flat surface. By this, an electrical connection structure with low resistance and/or a thermal connection structure with high thermal conductivity are obtained. The bundle of long thin carbon structures can be used suitably as a via, heat removal bump or other electronic element.
Public/Granted literature
- US20120040523A1 BUNDLE OF LONG THIN CARBON STRUCTURES, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE Public/Granted day:2012-02-16
Information query
