Invention Grant
- Patent Title: Refrigeration cycle device
- Patent Title (中): 制冷循环装置
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Application No.: US12601605Application Date: 2008-05-22
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Publication No.: US09086230B2Publication Date: 2015-07-21
- Inventor: Takashi Okazaki , Mihoko Shimoji , Shin Sekiya , Masayuki Kakuda , Takeshi Hatomura
- Applicant: Takashi Okazaki , Mihoko Shimoji , Shin Sekiya , Masayuki Kakuda , Takeshi Hatomura
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2007-139472 20070525; JP2008-086345 20080328
- International Application: PCT/JP2008/059461 WO 20080522
- International Announcement: WO2008/146709 WO 20081204
- Main IPC: F25B13/00
- IPC: F25B13/00 ; F25B39/04 ; F25B1/10 ; F25B41/00 ; F25B49/00 ; F04C18/02 ; F04C23/00 ; F25B29/00 ; F25B9/06

Abstract:
In order to provide a refrigeration cycle device that is compact and efficiently utilizing an expansion machine and reduced in manufacturing cost through the use of a first compressor and second compressor driven by an expansion machine, a heat radiator and an on-off valve are disposed between the first and the second compressors and the second heat radiator is utilized irrespective of the operating mode such as the cooling or heating operation. Also, the heat transfer area ratio, which is a ratio of the heat transfer area of the second heat source side heat exchanger relative to the total heat transfer area of the heat transfer areas of said first and second heat source side heat exchangers, is set, according to the air speed distribution, within a range at which the COP is at its peak. Thus, the second heat source side heat exchanger can be utilized even during the heating operation, providing a high efficiency refrigeration cycle device.
Public/Granted literature
- US20100170295A1 REFRIGERATION CYCLE DEVICE Public/Granted day:2010-07-08
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