Invention Grant
- Patent Title: Method of analyzing nitride semiconductor layer and method of manufacturing nitride semiconductor substrate using the analysis method
- Patent Title (中): 使用分析方法分析氮化物半导体层的方法和制造氮化物半导体衬底的方法
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Application No.: US13975413Application Date: 2013-08-26
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Publication No.: US09086321B2Publication Date: 2015-07-21
- Inventor: Yoshihata Yanase , Hiroshi Shirai , Jun Komiyama , Hiroshi Oishi
- Applicant: Covalent Materials Corporation
- Applicant Address: JP Tokyo
- Assignee: COVALENT MATERIALS CORPORATION
- Current Assignee: COVALENT MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2012-186354 20120827; JP2013-117655 20130604
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01J3/42 ; G01N21/33 ; G01N21/3563 ; G01N21/55

Abstract:
A method of analyzing a nitride semiconductor layer in which a mixing ratio at a ternary mixed-crystal nitride semiconductor layer can be analyzed non-destructively, simply, and precisely, even its surface is covered with a cap layer is provided. The nitride semiconductor layer having an AN layer or a BN layer with a thickness of 0.5 to 10 nm that is stacked on an AxB1-xN layer (A and B: 13 group elements, 0≦x≦1) is subjected to reflection spectroscopy to obtain a reflection spectrum of the AxB1-xN layer. Let an energy value in a peak position of the reflection spectrum be a band gap energy Egap, and let a band gap energy value of AxB1-xN (x=1) be EA and a band gap energy value of AxB1-xN (x=0) be EB, x is calculated from Equation Egap=(1−x)EB+xEA−bx(1−x) (where b is bowing parameter corresponding to A and B).
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