Invention Grant
- Patent Title: Three-dimensional integrated circuit and method for wireless information access thereof
- Patent Title (中): 用于无线信息访问的三维集成电路及方法
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Application No.: US13572533Application Date: 2012-08-10
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Publication No.: US09086452B2Publication Date: 2015-07-21
- Inventor: Mill-Jer Wang , Chewn-Pu Jou , Ching-Nen Peng , Huan-Neng Chen , Hung-Chih Lin , Kuang Kai Yen , Hao Chen , Feng Wei Kuo , Ming-Chieh Liu , Tsung-Hsiung Li
- Applicant: Mill-Jer Wang , Chewn-Pu Jou , Ching-Nen Peng , Huan-Neng Chen , Hung-Chih Lin , Kuang Kai Yen , Hao Chen , Feng Wei Kuo , Ming-Chieh Liu , Tsung-Hsiung Li
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L23/02 ; G06F17/50 ; H01L23/00 ; H01L25/065 ; G01R31/302

Abstract:
A three-dimensional integrated circuit (3DIC) and wireless information access methods thereof are provided. The proposed 3DIC includes a semiconductor structure, and a wireless power device (WPD) formed on the semiconductor structure for wirelessly receiving a power for operating a function selected from a group consisting of probing the semiconductor structure, testing the semiconductor structure and accessing a first information from the semiconductor structure.
Public/Granted literature
- US20140043148A1 THREE-DIMENSIONAL INTEGRATED CIRCUIT AND METHOD FOR WIRELESS INFORMATION ACCESS THEREOF Public/Granted day:2014-02-13
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