Invention Grant
US09086452B2 Three-dimensional integrated circuit and method for wireless information access thereof 有权
用于无线信息访问的三维集成电路及方法

Three-dimensional integrated circuit and method for wireless information access thereof
Abstract:
A three-dimensional integrated circuit (3DIC) and wireless information access methods thereof are provided. The proposed 3DIC includes a semiconductor structure, and a wireless power device (WPD) formed on the semiconductor structure for wirelessly receiving a power for operating a function selected from a group consisting of probing the semiconductor structure, testing the semiconductor structure and accessing a first information from the semiconductor structure.
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