A connecting mechanism of adjusting an angle of a first module relative to a second module of an electronic device is disclosed in the present invention. The connecting mechanism includes a hinge assembly disposed on the second module, a rod disposed on the hinge assembly and pivoting to the first module, a torsional spring disposed between the rod and the hinge assembly, and a damper assembly disposed on the rod and sheathed by the torsional spring. The hinge assembly includes a first hinge installed inside the second module, and a second hinge slidably disposed on the first hinge. The torsional spring drives the rod to rotate relative to the second hinge from a first position to a second position, so that the first module can stand on the second module. The damper assembly can be for absorbing a vibration generated from the rod.