Invention Grant
- Patent Title: Above motherboard interposer with quarter wavelength electrical paths
- Patent Title (中): 在主板上插入四分之一波长的电路径
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Application No.: US13491353Application Date: 2012-06-07
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Publication No.: US09086874B2Publication Date: 2015-07-21
- Inventor: Morgan Johnson , Frederick G. Weiss
- Applicant: Morgan Johnson , Frederick G. Weiss
- Applicant Address: US OR Beaverton
- Assignee: Morgan/Weiss Technologies Inc.
- Current Assignee: Morgan/Weiss Technologies Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Marger Johnson & McCollom PC
- Main IPC: H05K7/00
- IPC: H05K7/00 ; G06F1/32 ; H05K1/02 ; H01L23/32 ; H05K1/14 ; H05K1/18

Abstract:
A computing device has a circuit substrate having a socket, a main processor inserted into the socket, an interposer substrate inserted between the socket and the main processor, the circuit substrate, the socket and the interposer substrate being electrically connected, and peripheral circuit modules residing on the interposer substrate, wherein each peripheral circuit module has an electrical path having a path length to the main processor less than one-quarter of a wavelength of signals that will travel the electrical path.
Public/Granted literature
- US20120262862A1 ABOVE MOTHERBOARD INTERPOSER WITH QUARTER WAVELENGTH ELECTICAL PATHS Public/Granted day:2012-10-18
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