Invention Grant
- Patent Title: Multilayer ceramic electronic component and method of manufacturing the same
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13722524Application Date: 2012-12-20
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Publication No.: US09087639B2Publication Date: 2015-07-21
- Inventor: Jong Han Kim , Yoon Hee Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0043978 20120426
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/30 ; H01G4/01 ; H01G13/00 ; H01G4/012 ; H01G4/12

Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic body; and internal electrodes formed inside the ceramic body and having a plurality of non-electrode regions, wherein, on a cross-section taken in length and thickness directions of the ceramic body, when a thickness of the internal electrode is denoted by Te, a continuity of the internal electrode is denoted by C, an area of the internal electrode is denoted by Ae, an area of the plurality of non-electrode regions is denoted by Ao, and a maximum diameter of the non-electrode region having the maximum diameter among the plurality of non-electrode regions is denoted by Pmax, 0.1 μm≦Te≦0.5 μm, 1.1%≦Ao/Ae≦3.2%, Pmax≦120 nm, and 95%≦C≦99.5% are satisfied.
Public/Granted literature
- US20130286539A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-10-31
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