Invention Grant
US09087646B2 Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
有权
多层陶瓷电容器，其上具有多层陶瓷电容器的电路板的安装结构，用于多层陶瓷电容器的封装单元
- Patent Title: Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
- Patent Title (中): 多层陶瓷电容器，其上具有多层陶瓷电容器的电路板的安装结构，用于多层陶瓷电容器的封装单元
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Application No.: US13764193Application Date: 2013-02-11
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Publication No.: US09087646B2Publication Date: 2015-07-21
- Inventor: Young Ghyu Ahn , Sang Soo Park , Min Cheol Park , Byoung Hwa Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon, Gunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0126449 20121109
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/06 ; H01G2/06 ; H01G4/012 ; H01G4/12
Abstract:
There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as 1/2 of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as 1/2 of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.
Public/Granted literature
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