Invention Grant
- Patent Title: Very low inductance distributed capacitive filter assembly
- Patent Title (中): 非常低的电感分布式电容滤波器组件
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Application No.: US13592028Application Date: 2012-08-22
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Publication No.: US09087649B2Publication Date: 2015-07-21
- Inventor: Steven D. Sherwood , William F. Kienzler, III , Keith D. Rose , Peter J. Minni
- Applicant: Steven D. Sherwood , William F. Kienzler, III , Keith D. Rose , Peter J. Minni
- Applicant Address: US NY Endicott
- Assignee: BAE SYSTEMS CONTROLS INC.
- Current Assignee: BAE SYSTEMS CONTROLS INC.
- Current Assignee Address: US NY Endicott
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H01G4/38 ; H04B15/00 ; H01G2/06 ; H01G2/10 ; H01G4/224

Abstract:
A capacitive filter assembly and method including a housing having a power terminal connection for receiving electrical power. A plurality of capacitors in an electrically parallel configuration coupled to one or more side walls of the housing. The plurality of capacitors electrically communicating with a plurality of respective printed wiring boards (PWB) coupled to the capacitors inside the housing, and the plurality of capacitors being positioned between the power terminal connection in the housing and respective housing ground connections in the housing. A plurality of support structures coupled to the plurality of capacitors, respectively, the plurality of support structures being configured to mate with the respective printed wiring boards, the support structures being mounted in the housing such that the capacitors are coupled to the housing using their respective support structures.
Public/Granted literature
- US20140055213A1 VERY LOW INDUCTANCE DISTRIBUTED CAPACITIVE FILTER ASSEMBLY Public/Granted day:2014-02-27
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