Invention Grant
- Patent Title: Semiconductor integrated circuit and semiconductor integrated circuit apparatus
- Patent Title (中): 半导体集成电路和半导体集成电路设备
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Application No.: US13223356Application Date: 2011-09-01
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Publication No.: US09087714B2Publication Date: 2015-07-21
- Inventor: Yuuichi Ueda
- Applicant: Yuuichi Ueda
- Applicant Address: JP Osaka
- Assignee: RICOH ELECTRONIC DEVICES CO., LTD.
- Current Assignee: RICOH ELECTRONIC DEVICES CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Cooper & Dunham LLP
- Priority: JP2010-195889 20100901
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234

Abstract:
A semiconductor integrated circuit includes a substrate of a first conductivity type, and a first MOS transistor and a second MOS transistor both formed in the substrate. The first MOS transistor includes first drain and first source regions as first active regions of a second conductivity type; a second active region of the first conductivity type; a first gate electrode disposed between the first drain and source regions; and a first substrate electrode connected to the second active region. The second MOS transistor includes a second drain region and a second source region which are formed between the first source region and the second active region, such that the first source region is proximate to the second drain region. The first substrate electrode is electrically separated from the first drain and source electrodes, and the second MOS transistor is connected between the first substrate electrode and the first source electrode.
Public/Granted literature
- US20120049292A1 SEMICONDUCTOR INTEGRATED CIRCUIT AND SEMICONDUCTOR INTEGRATED CIRCUIT APPARATUS Public/Granted day:2012-03-01
Information query
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