Invention Grant
US09087761B2 Solid-state imaging device including an on-chip lens with two inorganic films thereon
有权
固态成像装置,包括其上具有两个无机膜的片上透镜
- Patent Title: Solid-state imaging device including an on-chip lens with two inorganic films thereon
- Patent Title (中): 固态成像装置,包括其上具有两个无机膜的片上透镜
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Application No.: US13248491Application Date: 2011-09-29
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Publication No.: US09087761B2Publication Date: 2015-07-21
- Inventor: Yoichi Otsuka , Akiko Ogino , Kiyotaka Tabuchi , Takamasa Tanikuni
- Applicant: Yoichi Otsuka , Akiko Ogino , Kiyotaka Tabuchi , Takamasa Tanikuni
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2010-227755 20101007
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L27/146 ; H01L27/148 ; H04N9/04

Abstract:
A solid-state imaging device includes a plurality of pixels formed on a semiconductor substrate and include a photoelectric conversion unit; a color filter on the pixels; an on-chip microlens made of an organic film on the color filter, corresponding to each of the pixels; a first inorganic film formed on a surface of the on-chip microlens and having a higher refraction index than the on-chip microlens; and a second inorganic film formed on a surface of the first inorganic film and having a lower refraction index than the on-chip microlens and the first inorganic film, in which at least the second inorganic film includes a non-lens area at an interface of an adjacent second inorganic film.
Public/Granted literature
- US20120086093A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2012-04-12
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