Invention Grant
- Patent Title: Manufacturing method of molded package
- Patent Title (中): 模制包装的制造方法
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Application No.: US13537314Application Date: 2012-06-29
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Publication No.: US09087794B2Publication Date: 2015-07-21
- Inventor: Masahiro Honda , Koutarou Andou , Shinpei Taga
- Applicant: Masahiro Honda , Koutarou Andou , Shinpei Taga
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2011-149058 20110705
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/31 ; G01L19/14 ; H01L21/56
Abstract:
In a manufacturing method of a molded package, a lead frame including an island portion and a support portion is prepared. A circuit chip is mounted on the island portion, and the sensor chip is arranged such that a first end section having an electric connecting portion is adjacent to the circuit chip and a second end section having a sensing portion is supported by the support portion. The circuit chip and the electric connecting portion of the first end section is electrically connected through a connection member. The circuit chip, the island portion, the connection member and the first end section are sealed with a resin while maintaining the support state. After the sealing, the support portion is cut from the lead frame and separated from the second end section.
Public/Granted literature
- US20130011970A1 MANUFACTURING METHOD OF MOLDED PACKAGE Public/Granted day:2013-01-10
Information query
IPC分类:
