Invention Grant
- Patent Title: Electronic substrate
- Patent Title (中): 电子基板
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Application No.: US13787225Application Date: 2013-03-06
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Publication No.: US09087820B2Publication Date: 2015-07-21
- Inventor: Nobuaki Hashimoto
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2005-197393 20050706
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10 ; H01L23/48 ; H01L25/16 ; H01L23/498

Abstract:
An electronic substrate includes: an electronic element provided on a first face of a semiconductor substrate having a through hole; a passive element provided on a second face of the semiconductor substrate; a first part of an interconnection pattern provided on the second face of the semiconductor substrate; an insulating layer provided on the second face of the semiconductor substrate; and a second part of the interconnection pattern provided on the insulating layer.
Public/Granted literature
- US20130181357A1 MANUFACTURING METHOD FOR AN ELECTRONIC SUBSTRATE Public/Granted day:2013-07-18
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