One embodiment includes an encapsulated semiconductor package having a lead frame with die pad surrounded by a plurality of first and second leadfingers. A semiconductor chip including chip contact pads on its upper active surface is attached to the die pad. A plurality of first bond wires, incoluding a first electrically conductive material, extend between the chip contact pads and the plurality of first leadfingers. A plurality of second bond wires, including a second electrically conductive material, extend between a chip contact pad and a second leadfinger. The semiconductor package further includes a plurality of electrically conducting means attached to the second leadfingers.