Invention Grant
- Patent Title: Electrically conductive device and manufacturing method thereof
- Patent Title (中): 导电装置及其制造方法
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Application No.: US14560729Application Date: 2014-12-04
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Publication No.: US09087845B2Publication Date: 2015-07-21
- Inventor: Xinpeng Wang , Haiyang Zhang
- Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION , SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Applicant Address: CN CN
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION (SHANGHAI),SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION (BEIJING)
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION (SHANGHAI),SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION (BEIJING)
- Current Assignee Address: CN CN
- Agency: Innovation Counsel LLP
- Priority: CN201110459310 20111231
- Main IPC: H01L29/43
- IPC: H01L29/43 ; H01L23/528 ; H01L23/532
Abstract:
An electrically conductive device and a manufacturing method thereof are provided. According to an exemplary embodiment, an electrically conductive device includes a graphene layer on a substrate, a protein tube portion on the graphene layer, and a conductor penetrating through the protein tube portion to the graphene layer, wherein the conductor is in electrical contact with the graphene layer.
Public/Granted literature
- US20150137370A1 ELECTRICALLY CONDUCTIVE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-05-21
Information query
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