Invention Grant
US09087896B2 Method of producing precision vertical and horizontal layers in a vertical semiconductor structure 有权
在垂直半导体结构中制造精密垂直和水平层的方法

Method of producing precision vertical and horizontal layers in a vertical semiconductor structure
Abstract:
The present invention relates to providing layers of different thickness on vertical and horizontal surfaces (15, 20) of a vertical semiconductor device (1). In particular the invention relates to gate electrodes and the formation of precision layers (28) in semiconductor structures comprising a substrate (10) and an elongated structure (5) essentially standing up from the substrate. According to the method of the invention the vertical geometry of the device (1) is utilized in combination with either anisotropic deposition or anisotropic removal of deposited material to form vertical or horizontal layers of very high precision.
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