Invention Grant
- Patent Title: Vertical power MOSFET and methods of forming the same
- Patent Title (中): 垂直功率MOSFET及其形成方法
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Application No.: US13588893Application Date: 2012-08-17
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Publication No.: US09087920B2Publication Date: 2015-07-21
- Inventor: Chun-Wai Ng , Hsueh-Liang Chou , Po-Chih Su , Ruey-Hsin Liu
- Applicant: Chun-Wai Ng , Hsueh-Liang Chou , Po-Chih Su , Ruey-Hsin Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/265
- IPC: H01L21/265 ; H01L21/8238 ; H01L27/092

Abstract:
A device includes a semiconductor layer of a first conductivity type, and a first and a second body region over the semiconductor layer, wherein the first and the second body regions are of a second conductivity type opposite the first conductivity type. A doped semiconductor region of the first conductivity type is disposed between and contacting the first and the second body regions. A gate dielectric layer is disposed over the first and the second body regions and the doped semiconductor region. A first and a second gate electrode are disposed over the gate dielectric layer, and overlapping the first and the second body regions, respectively. The first and the second gate electrodes are physically separated from each other by a space, and are electrically interconnected. The space between the first and the second gate electrodes overlaps the doped semiconductor region. The device further includes a MOS containing device.
Public/Granted literature
- US20130320432A1 Vertical Power MOSFET and Methods of Forming the Same Public/Granted day:2013-12-05
Information query
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