Invention Grant
- Patent Title: Light-emitting diode and method for preparing the same
- Patent Title (中): 发光二极管及其制备方法
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Application No.: US14166876Application Date: 2014-01-29
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Publication No.: US09087933B2Publication Date: 2015-07-21
- Inventor: Jin Xu , Jiangbo Wang , Rong Liu
- Applicant: HC Semitek Corporation
- Applicant Address: CN Wuhan
- Assignee: HC SEMITEK CORPORATION
- Current Assignee: HC SEMITEK CORPORATION
- Current Assignee Address: CN Wuhan
- Agency: Matthias Scholl P.C.
- Agent Matthias Scholl
- Priority: CN201110217923 20110801
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; H01L33/20 ; H01L33/60 ; H01L33/46 ; H01L21/02

Abstract:
A method for preparing a light-emitting diode having a vertical structure by stripping a GaN base epitaxial layer and a sapphire substrate by a wet process, the method including: a) preparing a graphical growth substrate; b) growing a GaN base light-emitting diode epitaxial layer on the graphical growth substrate, the GaN base light-emitting diode epitaxial layer from the bottom to the top successively including a N-type GaN layer and a P-type GaN layer; c) successively forming a transparent and electrically conductive film, an omni-directional reflection layer, an electrically conductive reflection layer, and a passive metal protection layer from the bottom to the top on the GaN base light-emitting diode epitaxial layer; and d) removing the first layer of stable material with a high melting point of the growth substrate by dry etching, exposing the N-type GaN layer, and preparing an N electrode on the N-type GaN layer.
Public/Granted literature
- US20140145204A1 LIGHT-EMITTING DIODE AND METHOD FOR PREPARING THE SAME Public/Granted day:2014-05-29
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