Invention Grant
- Patent Title: Wireless communication apparatus
- Patent Title (中): 无线通信装置
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Application No.: US13541162Application Date: 2012-07-03
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Publication No.: US09088069B2Publication Date: 2015-07-21
- Inventor: Akihiro Bungo
- Applicant: Akihiro Bungo
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/52 ; H01Q21/28 ; H01Q25/00

Abstract:
A wireless communication apparatus that includes a first antenna section having a first power feed point; a second antenna section having a second power feed point; a first electrically conductive plate extending between the first antenna section and the second antenna section; a second electrically conductive plate disposed substantially in parallel with the first electrically conductive plate and extending between the first antenna section and the second antenna section; and a short-circuiting member that electrically short-circuits the first electrically conductive plate and the second electrically conductive plate to each other such that a slit is formed by a part of a periphery of the first electrically conductive plate and a part of a periphery of the second electrically conductive plate.
Public/Granted literature
- US20130069836A1 WIRELESS COMMUNICATION APPARATUS Public/Granted day:2013-03-21
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