An electronic device including a frame having a front frame wall and a front panel assembly. The front frame wall is grounded and is parallel to the front panel assembly (FPA). The front panel assembly has a printed circuit board (PCB) on an interior side of it and PCB includes a ground contact. A detachable ground clip is attached to the front frame wall and has a protruding flexible arm that is configured to engage the ground contact of the PCB when the FPA is positioned for assembly. The central contact portion contacts or engages the ground contact on the PCB, and includes a visual indicator means integrated into the distal end and the front frame wall such that an observer looking at the interior side of the front frame wall can visually confirmed the central contact engagement with the ground contact of the printed circuit board.