Invention Grant
- Patent Title: Package module, package terminal and manufacturing method thereof
- Patent Title (中): 封装模块，封装端子及其制造方法
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Application No.: US13844265Application Date: 2013-03-15
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Publication No.: US09088121B2Publication Date: 2015-07-21
- Inventor: Xianming Wang , Shouyu Hong
- Applicant: Delta Electronics (Shanghai) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Current Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Morris, Manning & Martin LLP
- Agent John R. Harris
- Priority: CN201210464621 20121116
- Main IPC: H01R12/57
- IPC: H01R12/57 ; H01R43/16 ; H01R13/05
Abstract:
A package terminal is provided, which comprising: a base; an end portion with a first section; and a bent portion having a C-shape bend with a gradual change section, wherein the bent portion includes a first end and a second end, the first end is connected to the end portion, the second end is connected to the base, the bent portion includes a second section, and an area of the second section is smaller than an area of the first section.
Public/Granted literature
- US20140141631A1 PACKAGE MODULE, PACKAGE TERMINAL AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-05-22
Information query
IPC分类:
