Invention Grant
US09089062B2 Method for electroless nickel-phosphorous alloy deposition onto flexible substrates
有权
化学镀镍 - 磷合金沉积到柔性基板上的方法
- Patent Title: Method for electroless nickel-phosphorous alloy deposition onto flexible substrates
- Patent Title (中): 化学镀镍 - 磷合金沉积到柔性基板上的方法
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Application No.: US14368878Application Date: 2013-01-21
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Publication No.: US09089062B2Publication Date: 2015-07-21
- Inventor: Boris Alexander Janssen
- Applicant: Atotech Deutschland GmbH
- Applicant Address: DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: DE Berlin
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP12155801 20120216
- International Application: PCT/EP2013/051060 WO 20130121
- International Announcement: WO2013/120660 WO 20130822
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H05K1/09 ; C23C18/16 ; C23C18/36 ; H05K3/24 ; C23C18/50 ; H05K1/02 ; H05K3/22
Abstract:
The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.
Public/Granted literature
- US20150009638A1 METHOD FOR ELECTROLESS NICKEL-PHOSPHOROUS ALLOY DEPOSITION ONTO FLEXIBLE SUBSTRATES Public/Granted day:2015-01-08
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