Invention Grant
- Patent Title: Conductive glass substrate and preparation method thereof
- Patent Title (中): 导电玻璃基板及其制备方法
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Application No.: US14000194Application Date: 2013-07-05
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Publication No.: US09089081B2Publication Date: 2015-07-21
- Inventor: Zhao He
- Applicant: NANCHANG O-FILM TECH. CO., LTD.
- Applicant Address: CN Nanchang, Jiangxi
- Assignee: NANCHANG O-FILM TECH. CO., LTD.
- Current Assignee: NANCHANG O-FILM TECH. CO., LTD.
- Current Assignee Address: CN Nanchang, Jiangxi
- Agency: Haynes Beffel & Wolfeld LLP
- Agent James F. Hann
- Priority: CN201310066646 20130301
- International Application: PCT/CN2013/078891 WO 20130705
- International Announcement: WO2014/131259 WO 20140904
- Main IPC: B32B3/00
- IPC: B32B3/00 ; H05K3/46 ; G02F1/1333 ; G06F3/041 ; H05K1/03 ; H05K1/09 ; H05K3/00 ; G02F1/1343

Abstract:
A conductive glass substrate includes a glass substrate, a silicon dioxide layer, and a conductive mesh line, the glass substrate defines a meshed groove on a surface thereof; the silicon dioxide layer is attached to the surface of the glass substrate having the groove; the conductive mesh line have a shape adapted to that of the groove, the conductive mesh line is deposited in the groove and attached to the glass substrate via the silicon dioxide layer. In the conductive glass substrate, the conductive mesh line is received in the groove, compared with the conventional conductive glass substrate, a flexible substrate as a supporting body is not needed, the cost is down, and the structure of the conductive glass substrate is simple, further reducing the process, saving manpower and resources. A method of preparing the conductive glass substrate is provided.
Public/Granted literature
- US20140318836A1 CONDUCTIVE GLASS SUBSTRATE AND PREPARATION METHOD THEREOF Public/Granted day:2014-10-30
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