Invention Grant
US09093129B2 Discrete three-dimensional memory comprising dice with different BEOL structures
有权
具有不同BEOL结构的骰子的离散三维记忆
- Patent Title: Discrete three-dimensional memory comprising dice with different BEOL structures
- Patent Title (中): 具有不同BEOL结构的骰子的离散三维记忆
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Application No.: US14047011Application Date: 2013-10-06
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Publication No.: US09093129B2Publication Date: 2015-07-28
- Inventor: Guobiao Zhang
- Applicant: ChengDu HaiCun IP Technology LLC
- Applicant Address: CN ChengDu, SiChuan US OR Corvallis
- Assignee: ChengDu HaiCun IP Technology LLC,Guobiao Zhang
- Current Assignee: ChengDu HaiCun IP Technology LLC,Guobiao Zhang
- Current Assignee Address: CN ChengDu, SiChuan US OR Corvallis
- Main IPC: H01L23/02
- IPC: H01L23/02 ; G11C5/06 ; G11C5/02 ; G11C5/14 ; G11C8/14 ; H01L25/065 ; H01L25/10 ; G11C13/00
Abstract:
The present invention discloses a discrete three-dimensional memory (3D-M). It comprises at least a 3D-array die and at least a peripheral-circuit die. At least a peripheral-circuit component of the 3D-M is located on the peripheral-circuit die instead of the 3D-array die. The 3D-array die and the peripheral-circuit die have substantially different back-end-of-line (BEOL) structures, e.g. different number of BEOL layers, different number of interconnect layers, and/or different interconnect materials.
Public/Granted literature
- US20140036566A1 Discrete Three-Dimensional Memory Comprising Dice with Different BEOL Structures Public/Granted day:2014-02-06
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