Invention Grant
- Patent Title: Semiconductor structure and process thereof
- Patent Title (中): 半导体结构及其工艺
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Application No.: US13848736Application Date: 2013-03-22
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Publication No.: US09093285B2Publication Date: 2015-07-28
- Inventor: Ching-Wen Hung , Chih-Sen Huang , Po-Chao Tsao
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L27/06 ; H01L21/28 ; H01L49/02 ; H01L29/49 ; H01L29/51 ; H01L29/66

Abstract:
A semiconductor structure includes a metal gate, a second dielectric layer and a contact plug. The metal gate is located on a substrate and in a first dielectric layer, wherein the metal gate includes a work function metal layer having a U-shaped cross-sectional profile and a low resistivity material located on the work function metal layer. The second dielectric layer is located on the metal gate and the first dielectric layer. The contact plug is located on the second dielectric layer and in a third dielectric layer, thereby a capacitor is formed. Moreover, the present invention also provides a semiconductor process forming said semiconductor structure.
Public/Granted literature
- US20140284671A1 SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF Public/Granted day:2014-09-25
Information query
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