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US09093323B2 Methods for selectively coating three-dimensional features on a substrate 有权
在衬底上选择性地涂覆三维特征的方法

Methods for selectively coating three-dimensional features on a substrate
Abstract:
Methods here disclosed provide for selectively coating three-dimensional features on a substrate while avoiding liquid coating material wicking into micro cavities on the substrates. The steps include depositing a semiconductor layer on a sacrificial layer formed on a template and selectively etching the sacrificial layer. Then, the steps include releasing the semiconductor layer from the template and coating three-dimensional features on the substrate using a liquid coating step for applying a liquid coating material to a pre-determined surface of the three-dimensional features on the substrate.
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