Invention Grant
- Patent Title: Integrated circuit packaging system with heat spreader and method of manufacture thereof
- Patent Title (中): 具有散热器的集成电路封装系统及其制造方法
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Application No.: US14037110Application Date: 2013-09-25
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Publication No.: US09093415B2Publication Date: 2015-07-28
- Inventor: Oh Han Kim , Sell Jung , HeeSoo Lee , Jae Han Chung , YoungChul Kim
- Applicant: Oh Han Kim , Sell Jung , HeeSoo Lee , Jae Han Chung , YoungChul Kim
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H01L25/065
Abstract:
An integrated circuit packaging system, and method of manufacture therefor, includes: a substrate; a mold cap formed on the substrate; fiducial mark inscribed in the mold cap; a thermal interface material applied over the substrate and referenced by the fiducial mark; and a heat spreader, mounted on the thermal interface material, precisely positioned by a position notch aligned relative to the fiducial mark.
Public/Granted literature
- US20150084178A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2015-03-26
Information query
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