Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
- Patent Title (中): 半导体装置及半导体装置的制造方法
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Application No.: US14110131Application Date: 2012-04-03
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Publication No.: US09093434B2Publication Date: 2015-07-28
- Inventor: Akihiro Kimura , Takeshi Sunaga , Shouji Yasunaga , Akihiro Koga
- Applicant: Akihiro Kimura , Takeshi Sunaga , Shouji Yasunaga , Akihiro Koga
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Howison & Arnott, LLP
- Priority: JP2011-082405 20110404; JP2011-082560 20110404; JP2011-104349 20110509; JP2011-105511 20110510; JP2011-105512 20110510; JP2011-105513 20110510
- International Application: PCT/JP2012/059040 WO 20120403
- International Announcement: WO2012/137760 WO 20121011
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/495 ; H01L23/31 ; H01L23/433 ; H01L21/56 ; H01L23/36 ; H01L23/00
Abstract:
A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
Public/Granted literature
- US20140027891A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-01-30
Information query
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