Invention Grant
- Patent Title: Antenna-in-package structure
- Patent Title (中): 天线封装结构
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Application No.: US13574062Application Date: 2011-01-19
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Publication No.: US09093740B2Publication Date: 2015-07-28
- Inventor: Christopher Barratt , Chakib El Hassani , Pascal Ciais
- Applicant: Christopher Barratt , Chakib El Hassani , Pascal Ciais
- Applicant Address: FR Grasse
- Assignee: INSIGHT SIP SAS
- Current Assignee: INSIGHT SIP SAS
- Current Assignee Address: FR Grasse
- Agency: Young & Thompson
- Priority: EP10305066 20100120
- International Application: PCT/EP2011/050653 WO 20110119
- International Announcement: WO2011/089141 WO 20110728
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/50 ; H01Q9/04 ; H01Q1/24 ; H01Q9/42

Abstract:
An electronic device with an antenna of the antenna-in-package type (AIP) includes an upper surface on which a radiating element is provided. The radiating element has an open end and a feeding end. The antenna also includes an adaptation element. The antenna is characterized in that the adaptation element is provided at an area that is different from the upper surface of the antenna holding the radiating element. The adaptation element is connected, at one end, to an intermediate point of the radiating element and grounded at another end. The device allows a further size reduction of standard inverted F antennas (IFA).
Public/Granted literature
- US20120293392A1 ANTENNA-IN-PACKAGE STRUCTURE Public/Granted day:2012-11-22
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