Invention Grant
US09095062B2 Power module substrate, power module, and method for manufacturing power module substrate
有权
功率模块基板，功率模块和制造功率模块基板的方法
- Patent Title: Power module substrate, power module, and method for manufacturing power module substrate
- Patent Title (中): 功率模块基板，功率模块和制造功率模块基板的方法
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Application No.: US14078647Application Date: 2013-11-13
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Publication No.: US09095062B2Publication Date: 2015-07-28
- Inventor: Yoshirou Kuromitsu , Kazuhiro Akiyama , Takeshi Kitahara , Hiroshi Tonomura
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Brian S. Matross
- Priority: JP2008-129668 20080516; JP2008-129669 20080516; JP2008-129670 20080516
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/02 ; H05K1/18 ; H05K1/05 ; H01L23/373 ; H05K7/06
Abstract:
A power module substrate includes a ceramics substrate composed of Al2O3 having a top face. A metal plate composed of aluminum having a purity of 99.99% or more is joined to the top face of the ceramics substrate with a brazing filler metal which includes silicon interposed therebetween. A high concentration section is formed at a joint interface at which the metal plate is joined to the ceramics substrate, and has a silicon concentration that is more than five times the silicon concentration in the metal plate.
Public/Granted literature
- US20140071633A1 POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE Public/Granted day:2014-03-13
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