Invention Grant
- Patent Title: Circuit board
- Patent Title (中): 电路板
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Application No.: US13711547Application Date: 2012-12-11
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Publication No.: US09095068B2Publication Date: 2015-07-28
- Inventor: Seung Wook Park , Chang Bae Lee , Christian Romero , Mi Jin Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR10-2012-0011396 20120203
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K7/10 ; H05K7/00 ; H05K1/02 ; H05K3/46
Abstract:
Disclosed herein is a circuit board including: a base substrate including a via for power and a via pad for power connected to the via for power; and an insulating layer formed on the base substrate and including a dummy pattern formed in a region facing the via pad for power.
Public/Granted literature
- US20130199833A1 CIRCUIT BOARD Public/Granted day:2013-08-08
Information query
