Invention Grant
- Patent Title: Composition of a solder, and method of manufacturing a solder connection
- Patent Title (中): 焊料的组成以及焊接连接的制造方法
-
Application No.: US13626943Application Date: 2012-09-26
-
Publication No.: US09095933B2Publication Date: 2015-08-04
- Inventor: Nicolaas Johannes Anthonius Van Veen , Hossain Mohammad Biglari
- Applicant: Nicolaas Johannes Anthonius Van Veen , Hossain Mohammad Biglari
- Applicant Address: NL Eindhoven
- Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee: KONINKLIJKE PHILIPS N.V.
- Current Assignee Address: NL Eindhoven
- Agent Larry Liberchuk
- Priority: EP0412355 20040527
- Main IPC: B23K35/24
- IPC: B23K35/24 ; B23K35/26 ; B23K35/28 ; B23K35/02 ; H05K3/34 ; H01L23/00
Abstract:
The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
Public/Granted literature
- US20130021765A1 COMPOSITION OF A SOLDER, AND METHOD OF MANUFACTURING A SOLDER CONNECTION Public/Granted day:2013-01-24
Information query
IPC分类:
