Invention Grant
US09095953B2 Apparatus for polishing rear surface of substrate, system for polishing rear surface of substrate, method for polishing rear surface of substrate and recording medium having program for polishing rear surface of substrate
有权
用于抛光衬底后表面的设备,用于抛光衬底后表面的系统,用于抛光衬底后表面的方法和具有用于抛光衬底后表面的程序的记录介质
- Patent Title: Apparatus for polishing rear surface of substrate, system for polishing rear surface of substrate, method for polishing rear surface of substrate and recording medium having program for polishing rear surface of substrate
- Patent Title (中): 用于抛光衬底后表面的设备,用于抛光衬底后表面的系统,用于抛光衬底后表面的方法和具有用于抛光衬底后表面的程序的记录介质
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Application No.: US13158600Application Date: 2011-06-13
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Publication No.: US09095953B2Publication Date: 2015-08-04
- Inventor: Mitsunori Nakamori , Noritaka Uchida , Takehiko Orii , Takanori Miyazaki , Nobuhiko Mouri
- Applicant: Mitsunori Nakamori , Noritaka Uchida , Takehiko Orii , Takanori Miyazaki , Nobuhiko Mouri
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2010-138494 20100617; JP2010-214538 20100924
- Main IPC: B24B7/22
- IPC: B24B7/22 ; B24B51/00 ; B24B37/04

Abstract:
Provided are a rear substrate surface polishing device polishing a rear surface of a substrate, a rear substrate surface polishing system including the rear substrate surface polishing device, a rear substrate surface polishing method used in the rear substrate surface polishing device, and a storage medium for storing a program implemented with the rear substrate surface polishing method. In particular, the rear surface of the substrate is polished by a substrate polishing unit in accordance with information acquired from a prior process performed prior to the polishing process of the rear surface of the substrate at the substrate polishing unit. Further, the substrate polishing unit polishes the substrate with a polishing area determined on the basis of information acquired from a prior process. Furthermore, the polishing is performed by using any one or all of a plurality of substrate polishing units determined on the basis of information acquired from a prior process.
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