Invention Grant
- Patent Title: Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
- Patent Title (中): 电子设备案例，制造方法和模具以及移动通信终端
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Application No.: US13973103Application Date: 2013-08-22
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Publication No.: US09096029B2Publication Date: 2015-08-04
- Inventor: Jae Suk Sung , Sung Eun Cho , Ha Ryong Hong , Dae Kyu Lee , Ki Won Chang , Dae Seong Jeon , Tae Sung Kim , Dae Ki Lim , Hyun Do Park , Nam Il Seo
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2009-0035635 20090423
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; B29D99/00 ; B29C45/14 ; H01Q1/40 ; H01Q1/42 ; H01Q9/04 ; B29L31/34 ; H04M1/02 ; H04W88/02
Abstract:
An electronic device case having an antenna pattern embedded therein includes: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.
Public/Granted literature
- US20130335279A1 ELECTRONIC DEVICE CASE, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND MOBILE COMMUNICTIONS TERMINAL Public/Granted day:2013-12-19
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