Invention Grant
US09096046B2 Direct heating type card lamination apparatus 有权
直接加热式卡片贴合装置

Direct heating type card lamination apparatus
Abstract:
Provided is a direct heating type card lamination apparatus, and more particularly, to a direct heating type card lamination apparatus with a concise and simple structure that performs low power lamination by applying heat directly on a card and performs lamination conveniently and quickly without a waiting time. The direct heating type card lamination apparatus does not perform lamination by a heated roller after heating the roller with a heating element according to a conventional method but performs lamination by directly applying heat on a card by a momentarily heated lamination head. Accordingly, the direct heating type card lamination apparatus quickly and conveniently performs lamination with low power without energy loss or a waiting time.
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