Invention Grant
- Patent Title: Direct heating type card lamination apparatus
- Patent Title (中): 直接加热式卡片贴合装置
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Application No.: US13415827Application Date: 2012-03-08
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Publication No.: US09096046B2Publication Date: 2015-08-04
- Inventor: Changbum Kim
- Applicant: Changbum Kim
- Applicant Address: KR Seoul
- Assignee: IDP CORPORATION LTD.
- Current Assignee: IDP CORPORATION LTD.
- Current Assignee Address: KR Seoul
- Agency: Kile Park Reed & Houtteman PLLC
- Priority: KR10-2011-0021755 20110311
- Main IPC: B32B37/06
- IPC: B32B37/06 ; B32B37/00 ; B32B41/00

Abstract:
Provided is a direct heating type card lamination apparatus, and more particularly, to a direct heating type card lamination apparatus with a concise and simple structure that performs low power lamination by applying heat directly on a card and performs lamination conveniently and quickly without a waiting time. The direct heating type card lamination apparatus does not perform lamination by a heated roller after heating the roller with a heating element according to a conventional method but performs lamination by directly applying heat on a card by a momentarily heated lamination head. Accordingly, the direct heating type card lamination apparatus quickly and conveniently performs lamination with low power without energy loss or a waiting time.
Public/Granted literature
- US20130062017A1 DIRECT HEATING TYPE CARD LAMINATION APPARATUS Public/Granted day:2013-03-14
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