Invention Grant
- Patent Title: Joint assembly to form a sealed flow conduit
- Patent Title (中): 联合组装形成密封流道
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Application No.: US13847043Application Date: 2013-03-19
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Publication No.: US09096324B2Publication Date: 2015-08-04
- Inventor: Marcus Alexander Erickson , Mahesh K. Chengalva , Aaron Stephen Pahs
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: B64D37/00
- IPC: B64D37/00 ; B64C1/06 ; B64C1/26 ; B64C3/34
Abstract:
An apparatus comprising an elongated structure, a first plate, and a second plate. The elongated structure has a channel. The elongated structure is configured to be associated with a primary structure on a first side of the primary structure. The first plate is configured to be connected to the primary structure at a joint and cover a portion of the elongated structure. The first plate is connected to the primary structure on the first side of the primary structure. The second plate is configured to be connected to the primary structure on a second side of the primary structure.
Public/Granted literature
- US20140284426A1 Joint Assembly to Form a Sealed Flow Conduit Public/Granted day:2014-09-25
Information query
