The invention relates to silicone containing compositions able to form adhesive films on substrates, which typically comprises a curable silicone composition comprising components (a), (d) and at least one of (b) or (c): a. a polyorganosiloxane resin, composed of M and Q units having at least 3 alkenyl groups per molecule, herein after called “SiVi” groups, b. a polyorganosiloxane compound having at least 2 Si-bonded hydrogen groups on the polysiloxane chain, hereinafter called “SiH” groups, c. a telechelic polyorganosiloxane compound having terminal Si—H groups, and d. a hydrosilylation catalyst for the reaction of SiH groups with SiVi groups, e. a liquid diluent in an amount of from 0% to maximum 40% by weight of composition said components reacting together by hydrosilylation at a temperature below 400 C when they are brought into contact on a substrate and cure to form a continuous film on the substrate. Such formulation can cure quickly at room temperature and can provide good balance between adhesion and tack.