Invention Grant
- Patent Title: Deposition valve assembly and method of heating the same
- Patent Title (中): 沉积阀组件及其加热方法
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Application No.: US13312591Application Date: 2011-12-06
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Publication No.: US09096931B2Publication Date: 2015-08-04
- Inventor: Andrew M. Yednak, III , Todd Dunn , Carl White , Michael Manasco
- Applicant: Andrew M. Yednak, III , Todd Dunn , Carl White , Michael Manasco
- Applicant Address: US AZ Phoenix
- Assignee: ASM America, Inc
- Current Assignee: ASM America, Inc
- Current Assignee Address: US AZ Phoenix
- Agency: Snell & Wilmer LLP
- Main IPC: F16K49/00
- IPC: F16K49/00 ; C23C16/455 ; F16K27/00

Abstract:
A valve assembly including a mounting block having a first surface, a plurality of valves connected to the mounting block first surface, at least one fluid line connecting the plurality of valves spaced apart from the mounting block first surface, a heating element spaced apart from the at least one fluid line and located within a first insulating layer, and wherein the first insulating layer extends less than completely around the at least one fluid line.
Public/Granted literature
- US20130104992A1 DEPOSITION VALVE ASSEMBLY AND METHOD OF HEATING THE SAME Public/Granted day:2013-05-02
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