Invention Grant
- Patent Title: Polycrystalline diamond composites
- Patent Title (中): 多晶金刚石复合材料
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Application No.: US11858817Application Date: 2007-09-20
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Publication No.: US09097074B2Publication Date: 2015-08-04
- Inventor: Yuelin Shen , Youhe Zhang , Sujian Huang , Madapusi K. Keshavan
- Applicant: Yuelin Shen , Youhe Zhang , Sujian Huang , Madapusi K. Keshavan
- Applicant Address: US TX Houston
- Assignee: Smith International, Inc.
- Current Assignee: Smith International, Inc.
- Current Assignee Address: US TX Houston
- Agency: Snell & Wilmer L.L.P.
- Main IPC: E21B10/567
- IPC: E21B10/567

Abstract:
Polycrystalline diamond composites comprise a polycrystalline diamond body having a plurality of ultra-hard discrete regions dispersed within a polycrystalline diamond second region. The plurality of discrete regions has an density different from of the polycrystalline diamond second region. A metallic substrate can be joined to the body. The discrete regions can be relatively more thermal stable than, have a higher diamond density than, and/or may comprise a binder material that is different from the polycrystalline diamond second region. Polycrystalline diamond composites can be formed by combining already sintered granules with diamond grains to form a mixture, and subjecting the mixture to high pressure/high temperature conditions, wherein the granules form the plurality of discrete regions, or can be made by forming a plurality of unsintered granules, combining them with diamond grains to form a mixture, and then subjecting the mixture to first and second high pressure/high temperature conditions.
Public/Granted literature
- US20080073126A1 POLYCRYSTALLINE DIAMOND COMPOSITES Public/Granted day:2008-03-27
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