Invention Grant
- Patent Title: Property measurement apparatus and property measurement method
- Patent Title (中): 物性测量仪器和性能测量方法
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Application No.: US13371881Application Date: 2012-02-13
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Publication No.: US09097635B2Publication Date: 2015-08-04
- Inventor: Yoshihito Hayashi
- Applicant: Yoshihito Hayashi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2008-140530 20080529
- Main IPC: G01N11/14
- IPC: G01N11/14 ; G01N11/16 ; G01N11/00
Abstract:
Disclosed herein is a property measurement apparatus including: a first plate installed in a state of being rotatable and/or vibratable; and a second plate placed to face the first plate and provided with an impedance measurement section, wherein a stress caused by a distortion generated by rotating or vibrating the first plate to serve as a distortion given to a sample provided in a gap between the first and second plates is measured, and at the same time, the impedance measurement section measures the impedance of the sample.
Public/Granted literature
- US20120137753A1 PROPERTY MEASUREMENT APPARATUS AND PROPERTY MEASUREMENT METHOD Public/Granted day:2012-06-07
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