Invention Grant
- Patent Title: Substrate conveyance device and substrate conveyance method, exposure apparatus and exposure method, device manufacturing method
- Patent Title (中): 基板输送装置及基板输送方法，曝光装置及曝光方法，装置的制造方法
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Application No.: US13690577Application Date: 2012-11-30
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Publication No.: US09097986B2Publication Date: 2015-08-04
- Inventor: Atsushi Ohta , Takashi Horiuchi
- Applicant: NIKON CORPORATION , ZAO NIKON CO., LTD.
- Applicant Address: JP Tokyo JP Zao
- Assignee: NIKON CORPORATION,MIYAGI NIKON PRECISION CO., LTD.
- Current Assignee: NIKON CORPORATION,MIYAGI NIKON PRECISION CO., LTD.
- Current Assignee Address: JP Tokyo JP Zao
- Agency: Oliff PLC
- Priority: JP2003-349550 20031008
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03B27/42 ; G03D3/00
Abstract:
A substrate conveyance device that conveys a substrate having been exposed with a pattern image via a projection optical system and a liquid, the substrate conveyance device comprising: a liquid detector that detects the liquid adhering on the substrate.
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