Invention Grant
US09098791B2 Tag integrated circuit module apparatus and method of fabricating tag integrated circuit module apparatus
有权
标签集成电路模块装置及制造标签集成电路模块装置的方法
- Patent Title: Tag integrated circuit module apparatus and method of fabricating tag integrated circuit module apparatus
- Patent Title (中): 标签集成电路模块装置及制造标签集成电路模块装置的方法
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Application No.: US14023964Application Date: 2013-09-11
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Publication No.: US09098791B2Publication Date: 2015-08-04
- Inventor: Won Kyu Choi , Jong Suk Chae , Seung Hwan Jeong , Chan Won Park , Cheol Sig Pyo , Hae Won Son , Kun Hong Lee
- Applicant: Electronics and Telecommunications Research Institute , NETHOM, Co., Ltd
- Applicant Address: KR Daejeon KR Gyenggi-Do
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE,NETHOM CO., LTD
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE,NETHOM CO., LTD
- Current Assignee Address: KR Daejeon KR Gyenggi-Do
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2012-0123117 20121101
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077
Abstract:
Provided is a tag integrated circuit (IC) module apparatus and a method of fabricating tag IC module apparatus. The tag IC module apparatus may include an n-turn loop coil, n denoting a natural number, connected in series with a tag IC, and a printed circuit board (PCB) disposed below the tag IC and patterned with the n-turn loop coil.
Public/Granted literature
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