Invention Grant
- Patent Title: Near-field transducer peg encapsulation
- Patent Title (中): 近场传感器胶囊封装
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Application No.: US14220396Application Date: 2014-03-20
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Publication No.: US09099117B2Publication Date: 2015-08-04
- Inventor: James Gary Wessel , Sarbeswar Sahoo , Michael Christopher Kautzky
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: G11B5/00
- IPC: G11B5/00 ; G11B5/31 ; G11B5/127 ; G11B5/60 ; G02B6/122 ; G02B5/00
Abstract:
A near field transducer with a peg region, an enlarged region disposed adjacent the peg region, and a barrier material disposed between the peg region and the enlarged region. The barrier material reduces or eliminates interdiffusion of material between the peg region and the enlarged region.
Public/Granted literature
- US20140376342A1 NEAR-FIELD TRANSDUCER PEG ENCAPSULATION Public/Granted day:2014-12-25
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