Invention Grant
- Patent Title: Memory module and memory system comprising same
- Patent Title (中): 内存模块和包含它的存储器系统
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Application No.: US14157070Application Date: 2014-01-16
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Publication No.: US09099166B2Publication Date: 2015-08-04
- Inventor: Jun Hee Shin , Won Hyung Song , Jong Min Lee , You Keun Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2013-0013878 20130207
- Main IPC: G11C8/06
- IPC: G11C8/06 ; G11C5/04 ; G11C7/10

Abstract:
A memory module comprises a plurality of semiconductor memory devices each comprising a mode register set (MRS) circuit configured to generate an enable signal corresponding to an error mode of the semiconductor memory device in response to an MRS command received from a command decoder, and an address buffer configured to store a predetermined address signal, to receive an address signal and corresponding data from an external device, and to compare the address signal received with the predetermined address signal in response to the enable signal. As a consequence of determining that the address signal received from the external device is the same as the predetermined address signal stored in the address buffer, data different from the corresponding data received from the external device is written to a memory cell corresponding to the predetermined address signal.
Public/Granted literature
- US20140219044A1 MEMORY MODULE AND MEMORY SYSTEM COMPRISING SAME Public/Granted day:2014-08-07
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