Invention Grant
- Patent Title: Method of forming conductive films with micro-wires
- Patent Title (中): 用微丝形成导电膜的方法
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Application No.: US14017638Application Date: 2013-09-04
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Publication No.: US09099227B2Publication Date: 2015-08-04
- Inventor: Yongcai Wang , John Andrew Lebens , Mitchell Lawrence Wright
- Applicant: Yongcai Wang , John Andrew Lebens , Mitchell Lawrence Wright
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent J. Lanny Tucker
- Main IPC: H01B13/00
- IPC: H01B13/00 ; H01B1/02 ; H01B13/30 ; G03F7/00

Abstract:
A pattern of conductive micro-wires as in a conductive pattern can be prepared using photo-lithography, or imprint technology. A photocurable composition is cured to form a pattern of photocured micro-channels. A conductive composition comprising metal nano-particles is added to the photocured micro-channels and excess conductive composition outside the photocured micro-channels is removed. The conductive composition in the photocured micro-channels is then dried at a temperature of less than 60° C. The dried conductive composition in the photocured micro-channels is treated with hydrogen chloride vapor to form conductive micro-wires in the photocured micro-channels at a temperature of less than 60° C. The outer surface of the conductive micro-wires is then polished in the presence of water, to form a micro-wire pattern.
Public/Granted literature
- US20150064426A1 METHOD OF FORMING CONDUCTIVE FILMS WITH MICRO-WIRES Public/Granted day:2015-03-05
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