Invention Grant
- Patent Title: Modular liquid cooling system
- Patent Title (中): 模块化液体冷却系统
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Application No.: US13330058Application Date: 2011-12-19
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Publication No.: US09099237B2Publication Date: 2015-08-04
- Inventor: John A. Balcerak , Jeremy J. Keegan , William K. Siebert , Neil Gollhardt , Scott D. Day
- Applicant: John A. Balcerak , Jeremy J. Keegan , William K. Siebert , Neil Gollhardt , Scott D. Day
- Applicant Address: US OH Mayfield Height
- Assignee: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
- Current Assignee: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
- Current Assignee Address: US OH Mayfield Height
- Agency: Quarles & Brady LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01F27/10 ; H01L23/473 ; H01F27/32

Abstract:
Cooling systems include a first passageway forming member that includes first and second ends and at least one connecting recess that opens into first and second passageways formed by the first passageway forming member. A second passageway forming member includes first and second ends and inlet and outlet ports proximate the first end such that the first end, including an elastomeric seal and the inlet and outlet ports, is sealably insertable in and removable from the at least one connecting recess, where the inlet port opens into the first passageway and the outlet port opens into the second passageway, and where, when the first end is inserted in the at least one connecting recess, the elastomeric seal is sandwiched between and in substantial contact with both the first end and the first passageway forming member.
Public/Granted literature
- US20120085524A1 Modular Liquid Cooling System Public/Granted day:2012-04-12
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