Invention Grant
- Patent Title: Multilayer ceramic electronic component and method of manufacturing the same
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US14061744Application Date: 2013-10-23
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Publication No.: US09099243B2Publication Date: 2015-08-04
- Inventor: Su Hwan Cho , Jong Han Kim , Seung Ho Lee , Jae Yeol Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0086318 20130722
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/30 ; H01G4/06 ; H05K1/18

Abstract:
There is provided a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and an internal electrode formed in the ceramic body, wherein on a cross-section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode satisfies 0.1 μm≦Te≦1.0 μm, and when the internal electrode is divided into three regions including a central region and both edge regions in a width direction of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode, connectivity of the internal electrode in the edge regions satisfies 75%≦S≦98%, and a ratio of connectivity of the internal electrode in the edge regions to connectivity of the internal electrode in the central region is 0.9 to 0.98.
Public/Granted literature
- US20150022941A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-01-22
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